CEM-1 PCB, CEM-1 Printed Circuit Board Manufacturing

CEM-1 PCB Board
CEM-1 PCB Board

CEM1 PCB Composite epoxy materials (CEM) are a group of composite materials typically made from woven glass fabric surfaces and non-woven glass core combined with epoxy synthetic resin. They are typically used in printed circuit boards.

Welcome to EastwinPCBA – one of the leading manufacturers and suppliers of CEM-1 PCB circuit boards in China. Our factory is engaged in PCB manufacturing and offering customized high quality and high-performance custom cem1 PCB at the competitive price. High reliability, strong diversity and expert advice are our characteristics. Please contact us if you have the inquiry.

Eastwin PCB Fabrication Capability
No Item PCB Process Capability
1 Base material Normal TG FR4, High TG FR4, PTFE, Rogers, Low Dk/Df etc.
2 Solder mask color green, red, blue, white, yellow, purple,black
3 Legend color white, yellow, black, red
4 Surface treatment type ENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver
5 Max. layer-up(L) 50
6 Max. unit size (mm) 620*813 (24″*32″)
7 Max. working panel size (mm) 620*900 (24″x35.4″)
8 Max. board thickness (mm) 12
9 Min. board thickness(mm) 0.3
10 Board thickness tolerance (mm) T<1.0 mm: +/-0.10mm ;  T≥1.00mm: +/-10%
11 Registration tolerance (mm) +/-0.10
12 Min. mechanical drilling hole diameter (mm) 0.15
13 Min. laser drilling hole diameter(mm) 0.075
14 Max. aspect(through hole) 15:1
Max. aspect(micro-via) 1.3:1
15 Min. hole edge to copper space(mm) L≤10, 0.15;L=12-22,0.175;L=24-34, 0.2;L=36-44, 0.25;L>44, 0.3
16 Min. Inner layer clearance(mm) 0.15
17 Min. hole edge to hole edge space(mm) 0.28
18 Min. hole edge to profile line space(mm) 0.2
19 Min. Inner layer copper to profile line space (mm) 0.2
20 Registration tolerance between holes (mm) ±0.05
21 Max. finished copper thickness(um) Outer Layer: 420   (12oz)
Inner Layer: 210   (6oz)
22 Min. trace width (mm) 0.075 (3mil)
23 Min. trace space (mm) 0.075 (3mil)
24 Solder mask thickness (um) line corner :  >8 (0.3mil)
upon copper: >10 (0.4mil)
25 ENIG golden thickness (um) 0.025-0.125
26 ENIG nickle thickness (um) 3-9
27 Sterling silver thickness (um) 0.15-0.75
28 Min. HAL tin thickness (um) 0.75
29 Immersion tin thickness (um) 0.8-1.2
30 Hard-thick gold plating gold thickness  (um) 1.27-2.0
31 golden finger plating gold thickness (um) 0.025-1.51
32 golden finger plating nickle thickness(um) 3-15
33 flash gold plating gold thickness (um) 0,025-0.05
34 flash gold plating nickle thickness  (um) 3-15
35 profile size tolerance (mm) ±0.08
36 Max. solder mask plugging hole size (mm) 0.7
37 BGA pad (mm) ≥0.25 (HAL or HAL Free:0.35)
38 V-CUT blade position tolerance (mm) +/-0.10
39 V-CUT position tolerance (mm) +/-0.10
40 Gold finger bevel angle tolerance (o) +/-5
41 Impedance tolerance (%) +/-5%
42 Warpage tolerance (%) 0.75%
43 Min. legend width  (mm) 0.1
44 Fire flame class 94V-0
Special for Via in pad products Resin plugged hole size (min.) (mm) 0.3
Resin plugged hole size (max.) (mm) 0.75
Resin plugged board thickness (min.) (mm) 0.5
Resin plugged board thickness (max.) (mm) 3.5
Resin plugged maximum aspect ratio 8:1
Resin plugged minimum hole to hole space (mm) 0.4
Can difference hole size in one board? yes
Max. panel size (finished) (mm) 880 ×580
Max. working panel size (mm) 914 × 602
Max. board thickness (mm) 12
Max. layer-up(L) 40
Aspect 30:1 (Min. hole: 0.4 mm)
Line wide/space (mm) 0.075/ 0.075
Back drill capability Yes
Tolerance of back drill (mm) ±0.05
Tolerance of  press fit holes (mm) ±0.05
Surface treatment type OSP, sterling silver, ENIG
Rigid-flex board Hole size (mm) 0.2
Dielectrical thickness (mm) 0.025
Working Panel size (mm) 350 x 500
Line wide/space (mm) 0.075/ 0.075
Stiffener Yes
Flex board layers (L) 8 (4plys of flex board)
Rigid board layers (L) ≥14
Surface treatment All
Flex board in mid or outer layer Both
Special for HDI products Laser drilling hole size (mm) 0.075
Max. dielectric thickness (mm) 0.15
Min. dielectric thickness (mm) 0.05
Max. aspect 1.5:1
Bottom Pad size (under micro-via) (mm) Hole size+0.15
Top side Pad size ( on micro-via) (mm) Hole size+0.15
Copper filling or not (yes or no) (mm) yes
Via in Pad design or not ( yes or no) yes
Buried hole resin plugged (yes or no) yes
Min. via size can be copper filled (mm) 0.1
Max. stack times 4

EastwinPCBA has over 15 years experience in CEM-1 circuit board manufacturing and continues to pursue breakthroughs. We have opened new plants and introduced new advanced processing equipment. We can do fast delivery, and strictly control the quality of production to ensure the reliability of production.

If you’re looking for a quality CEM-3 PCB Boards provider, EastwinPCBA can help. Contact us at mike@szeastwin.com.cn, or call us at +86-755-23573370-833.