Professional 10 Layers PCB Manufacturer
EastwinPCBA as a industry leading of PCB manufacturer with over 15 Years.
Focus on special circuit board manufacturing,
such as Multilayer PCB, Rigid-flex PCB, HDI PCB, Controlled impedance PCB, Radio Frequency PCB,
From quick turn prototype to mass products.
Also, we provide one-stop PCB assembly solution from Components source to PCB assembly.
This allows our customers to get-to-market faster, affordable, and more efficiently.
Partner with us today and accelerate your innovative development projects
EastwinPCBA’ More PCB Manufacturer and Services
We have the PCB manufacturing capabilities to build simple double-sided boards to complex multilayer PCBs. Please review the example printed circuits below and let us know if you have any questions or would like a formal quote:
Our 10 Layers PCB Manufacturing Capabilities
At EastwinPCBA, we get a number of clients who consistently inquire about 10 Layers PCBs. The advances in resin technology and utilization of high-grade prepreg have allowed us to steadily meet this demand. In our 10 layer PCB boards, we utilize prepreg glass cloth sheets and copper foils for the outer levels. We then create the layers, interchanging between pretreated cores and prepreg.
We utilize high-quality presses to bond the layers together. The 10 layer stack is first placed under a press to pin the baseplates and the stack together. The PCB is then placed in a bonding press, which uses heat and pressure to bond the layers together. The heat cures the resin in the prepreg and the pressure bonds the various layers.
The following files would be needed for the 10-layers PCB production:
|Available Color||Green, Red, Yellow, Blue, White, Black|
|Silk Screen||White, Black (For White Solder Mask only)|
|Maximum Size||45cm X 120cm|
|Board Thickness||0.6mm,0.8mm, 1.0mm, 1.2mm, 1.6mm|
|Thickness Tolerance (t≥1.0mm)||± 10%|
|Thickness Tolerance (t<1.0mm)||± 0.1mm|
|Insulation Layer Thickness||0.075mm–5.00mm|
|Minimum PCB track||6mil (Recommend >8mil)|
|Minimum Track/Vias Space||6mil (Recommend >8mil)|
|Minimum pads Space||8mil|
|min clearance between traces and through holes (Plug-in)||16mil|
|Minimum silkscreen text size||32mil|
|Out Layer Copper Thickness||1oz(35um)|
|Inner Layer Copper Thickness||1oz(35um)|
|Drilling Hole (Mechanical)||0.3mm—6.35mm|
|Drill Diameter Tolerance (unplated)||0.05mm|
|Drill Diameter Tolerance (plated)||0.1mm|
|Outline Tolerance (Mechanical)||±0.20mm|
|Solder Mask Type||Photosensitive ink|
|SMT min Solder Mask Width||0.25mm|
|Min Solder Mask Clearance||0.25mm|
|Solder Mask Thickness||15um|
|Surface Finish||HASL, HASL (Lead Free), ENIG.|